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APF30-30-13CB

Part No APF30-30-13CB
Manufacturer CTS Electronic Components
Description HEATSINK LOW-PROFILE FORGED
Lead Free Status / RoHS Status Lead Free / RoHS compliant
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Specifications

Data sheet

Package Cooled:Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:Thermal Tape, Adhesive (Not Included)
Length:1.181" (30.00mm)
Diameter:-
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Detailed Description:Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Height Off Base (Height of Fin):0.500" (12.70mm)
Moisture Sensitivity Level (MSL):1 (Unlimited)
Manufacturer Standard Lead Time:14 Weeks
Shape:Square, Fins
Email:info@shengyuic.com
Series:APF
Width:1.181" (30.00mm)
Type:Top Mount
Other Names:294-1155 APF303013CB
Material:Aluminum
Thermal Resistance @ Forced Air Flow:2.50°C/W @ 200 LFM
Material Finish:Black Anodized
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Natural:-

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