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XCZU3CG-L1SFVA625I

Part No XCZU3CG-L1SFVA625I
Manufacturer Xilinx
Description IC FPGA 180 I/O 625FCBGA
Lead Free Status / RoHS Status Lead Free / RoHS compliant
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Specifications

Data sheet

RAM Size:256KB
Package / Case:625-BFBGA, FCBGA
Packaging:Tray
Supplier Device Package:625-FCBGA (21x21)
Number of I/O:180
Speed:500MHz, 1.2GHz
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Detailed Description:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 256KB 500MHz, 1.2GHz 625-FCBGA (21x21)
Flash Size:-
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Moisture Sensitivity Level (MSL):4 (72 Hours)
Manufacturer Standard Lead Time:10 Weeks
Core Processor:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes:Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Email:info@shengyuic.com
Series:Zynq® UltraScale+™ MPSoC CG
Architecture:MCU, FPGA
Operating Temperature:-40°C ~ 100°C (TJ)
Peripherals:DMA, WDT

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