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XCZU11EG-L1FFVC1156I

Part No XCZU11EG-L1FFVC1156I
Manufacturer Xilinx
Description IC FPGA 360 I/O 1156FCBGA
Lead Free Status / RoHS Status Lead Free / RoHS compliant
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Specifications

Data sheet

RAM Size:256KB
Package / Case:1156-BBGA, FCBGA
Packaging:Tray
Supplier Device Package:1156-FCBGA (35x35)
Number of I/O:360
Speed:500MHz, 600MHz, 1.2GHz
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Detailed Description:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 256KB 500MHz, 600MHz, 1.2GHz 1156-FCBGA (35x35)
Flash Size:-
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Moisture Sensitivity Level (MSL):4 (72 Hours)
Manufacturer Standard Lead Time:10 Weeks
Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes:Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Email:info@shengyuic.com
Series:Zynq® UltraScale+™ MPSoC EG
Architecture:MCU, FPGA
Operating Temperature:-40°C ~ 100°C (TJ)
Peripherals:DMA, WDT

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