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THINC23-21.5-11.4-5.8-0.8

Part No THINC23-21.5-11.4-5.8-0.8
Manufacturer t-Global Technology
Description THERM PAD 21.5X11.4MMX5.8MM GRAY
Lead Free Status / RoHS Status Lead Free / RoHS compliant
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Specifications

Data sheet

Thermal Conductivity:1.9 W/m-K
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Detailed Description:Thermal Pad Gray 21.50mm x 11.40mm x 5.80mm Rectangular
Adhesive:-
Moisture Sensitivity Level (MSL):1 (Unlimited)
Manufacturer Standard Lead Time:12 Weeks
Shape:Rectangular
Thermal Resistivity:-
Email:info@shengyuic.com
Outline:21.50mm x 11.40mm x 5.80mm
Color:Gray
Series:THINC
Usage:-
Type:Interface Cap
Thickness:0.0315" (0.800mm)
Material:Silicone
Backing, Carrier:-

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