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DS34S132GN

Part No DS34S132GN
Manufacturer Maxim Integrated
Description IC TDM/PACKET TRANSPORT 676BGA
Lead Free Status / RoHS Status Contains lead /RoHS non-compliant
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Specifications

Data sheet

Package / Case:676-BGA
Mounting Type:Surface Mount
Packaging:Tray
Supplier Device Package:676-TEPBGA (27x27)
Lead Free Status / RoHS Status:Contains lead / RoHS non-compliant
Detailed Description:Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27)
Voltage - Supply:1.8V, 3.3V
Interface:TDMoP
Moisture Sensitivity Level (MSL):1 (Unlimited)
Email:info@shengyuic.com
Function:TDM-over-Packet (TDMoP)
Series:-
Base Part Number:DS34S132
Includes:-
Current - Supply:-
Number of Circuits:1
Operating Temperature:-40°C ~ 85°C

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