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BGA0002-S

Part No BGA0002-S
Manufacturer Chip Quik, Inc.
Description STENCIL BGA-324 .8MM
Lead Free Status / RoHS Status Lead Free / RoHS compliant
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Specifications

Data sheet

Thermal Center Pad:-
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Inner Dimension:-
Outer Dimension:1.350" L x 1.950" W (34.29mm x 49.53mm)
Moisture Sensitivity Level (MSL):1 (Unlimited)
Manufacturer Standard Lead Time:2 Weeks
Email:info@shengyuic.com
Series:Proto-Advantage
Type:BGA
Thickness:0.0040" (0.102mm)
Other Names:BGA0002S
Material:Stainless Steel
Pitch:0.031" (0.80mm)
Number of Positions:324

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