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A2F060M3E-FGG256I

Part No A2F060M3E-FGG256I
Manufacturer Microsemi
Description IC FPGA 60K GATES 128KB 256FBGA
Lead Free Status / RoHS Status Lead Free / RoHS compliant
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Specifications

Data sheet

RAM Size:16KB
Package / Case:256-LBGA
Packaging:Tray
Supplier Device Package:256-FBGA (17x17)
Number of I/O:MCU - 26, FPGA - 66
Speed:80MHz
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Detailed Description:ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 128KB 16KB 80MHz 256-FBGA (17x17)
Flash Size:128KB
Connectivity:EBI/EMI, I²C, SPI, UART/USART
Moisture Sensitivity Level (MSL):3 (168 Hours)
Core Processor:ARM® Cortex®-M3
Primary Attributes:ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Email:info@shengyuic.com
Series:SmartFusion®
Base Part Number:A2F060M3E
Architecture:MCU, FPGA
Operating Temperature:-40°C ~ 100°C (TJ)
Peripherals:DMA, POR, WDT

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